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MICROPLANAR® CMP3700M™ Tungsten Slurry
- New manufacturing technology for lower CoO
- Lower cost per wafer pass
- Lower logistics, storage & handling costs
- Customer proven, in high volume manufacturing
- Colloidal Silica, hydrogen peroxide based
- Improved performance compared to competition (lower defect, better dishing and erosion, no edge erosion)
- IP Protected
- Datasheet [PDF, 347KB]
- MSDS [PDF, 19KB]
MICROPLANAR® CMP3850™ Tungsten Slurry
- New manufacturing technology for lower CoO:
- Lower cost per wafer pass
- Lower logistics, storage & handling costs
- Tunable selectivity
- Colloidal Silica based
- IP Protected
- Datasheet [PDF, 254KB]
- MSDS [PDF, 19KB]
Contact us for more information about our products.
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