|
CoppeReady® Cu3900 Copper Slurry
- Tunable Removal Rates Provide Tailored Process Latitude
- Qualified in 65nm and 45nm Production
- Improved Cost of Ownership Using DuPont Air Products NanoMatierals' DCmP™ Formulations
- Eliminates the Need for Pad Cleaning Resulting in Improved Tool Throughout
- Leading Edge Dishing and Erosion Performance
- Datasheet [PDF, 308KB]
- MSDS [PDF, 19KB]
CoppeReady® Cu3988 Copper Slurry
- Tunable polish rate to meet various process requirements with different dilutions and polish down forces for bulk and copper clear process steps
- Abrasive with optimized zeta potential to increase suspension stability
- Low abrasive concentration and dual inhibitor system with excellent dishing/erosion and defect performance
- Eliminates need for pad cleaning resulting in improved throughput
- Manufacturing and shipping with higher concentration for better cost of ownership
- Datasheet [PDF, 210KB]
Barrier Products
Contact us for more information about our products.
|
