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Wafer Polish Products

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DA NanoMaterials’ wafer polish product portfolio contains a broad range of formulated colloidal silica-based slurries used in silicon wafer polish applications.

Contact us for product MSDS.

  • Mazin™ SR310 Colloidal Silica Slurry

    • Lower metals contamination, with the lowest point-of-use trace metals level [Cu 0.3 ppb at POU] in the sodium silicate-based colloidal silica slurries available in the market
    • When used in conjunction with DA NanoMaterials’ chelating technology and amine free technology, offers a reduction of wafer metals contamination
    • Excellent polishing performance, including high removal rate, good surface result, fewer residue particles and excellent cost performance
    • Excellent cost of ownership with high dilution ration [20 times dilution is available], offering higher productivity
    • Less silica adhesion to polishing polishers
    • Less risk of scratch and tool down time
    SR310 Product Sheet
  • Mazin™ SR330 Colloidal Silica Slurry

    • Lower metals contamination, with the lowest point-of-use trace metals level [Cu 0.3 ppb at POU] in the sodium silicate-based colloidal silica slurries available in the market
    • When used in conjunction with DA NanoMaterials’ chelating technology and amine free technology, offers a reduction of wafer metals contamination
    • Excellent polishing performance, including high removal rate, good surface result, fewer residue particles and excellent cost performance
    • Excellent cost of ownership with high dilution ration [40 times dilution is available], offering higher productivity
    • Less silica adhesion to polishing polishers
    • Less risk of scratch and tool down time
    SR330 Product Sheet
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US Corporate Headquarters

2507 West Erie Drive
Tempe, Arizona 85282
United States

 

Formulation Laboratory
2441 West Erie Drive
Tempe, Arizona 85282


Customer Service

Phone: [602] 412.2431
Toll Free: [800] 356.7632