Wafer Polish Products

DA NanoMaterials’ wafer polish product portfolio contains a broad range of formulated colloidal silica-based slurries used in silicon wafer polish applications.

Contact us for product MSDS.

• Mazin™ SR310 Colloidal Silica Slurry

  • Lower metals contamination, with the lowest point-of-use trace metals level [Cu 0.3 ppb at POU] in the sodium silicate-based colloidal silica slurries available in the market
  • When used in conjunction with DA NanoMaterials’ chelating technology and amine free technology, offers a reduction of wafer metals contamination
  • Excellent polishing performance, including high removal rate, good surface result, fewer residue particles and excellent cost performance
  • Excellent cost of ownership with high dilution ration [20 times dilution is available], offering higher productivity
  • Less silica adhesion to polishing polishers
  • Less risk of scratch and tool down time
  SR310 Product Sheet
  

• Mazin™ SR330 Colloidal Silica Slurry

  • Lower metals contamination, with the lowest point-of-use trace metals level [Cu 0.3 ppb at POU] in the sodium silicate-based colloidal silica slurries available in the market
  • When used in conjunction with DA NanoMaterials’ chelating technology and amine free technology, offers a reduction of wafer metals contamination
  • Excellent polishing performance, including high removal rate, good surface result, fewer residue particles and excellent cost performance
  • Excellent cost of ownership with high dilution ration [40 times dilution is available], offering higher productivity
  • Less silica adhesion to polishing polishers
  • Less risk of scratch and tool down time
  SR330 Product Sheet
  

• Copper CMP
• Barrier CMP
• Tungsten CMP
• Shallow Trench Isolation [STI] CMP
• ILD and PMD CMP
• Specialty Films
• PRAM [GST/IST]
• 3D Packaging CMP
• Wafer Polish Products