Custom Solutions for your CMP & Wafer Polish Needs

With market-leading products in nine distinct categories, DA NanoMaterials offers a complete portfolio of vertically integrated solutions to your chemical mechanical planarization, metallic film polishing and wafer polishing needs – as well as advanced research and development efforts to bring you an ever-widening array of unique slurry products.
 
Not only are our products designed and tested for reliability and superior range of selectivity, but they’re also fully customizable – so instead of adjusting your procedures to fit our products, we can create a custom-fit solution designed for your distinct needs.

Our current product portfolio includes:

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  CMP Slurries

  • Copper CMP Products
    • CoppeReady® Cu3900 Copper Slurry
    • CoppeReady® Cu3988 Copper Slurry
  • Barrier CMP Products
    • CoppeReady® DP6545M-05 Barrier Slurry
    • CMP6890 Barrier Slurry
  • Tungsten CMP Products
    • MicroPlanar® CMP3700M™ Tungsten Slurry
    • MicroPlanar® CMP3720 Tungsten Slurry
    • MicroPlanar® CMP3730 Tungsten Slurry
    • MicroPlanar® CMP3850™ Tungsten Slurry
  • Shallow Trench Isolation [STI] CMP Products
    • MicroPlanar® STI2100™ Series
  • ILD and PMD CMP Products
    • MicroPlanar® IMD2400
  • Specialty Films Products
    • Cobalt Specialty Film Slurry
    • Nickel Specialty Film Slurry
    • Ruthenium Barrier Slurry
  • PRAM [GST/IST] Products
    • PRAM [GST/IST] Slurry
  • 3D Packaging CMP Products
    • TSV Slurry Series
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  Wafer Polish Products

  • Wafer Polish Products
    • Mazin™ SR310 Colloidal Silica Slurry
    • Mazin™ SR330 Colloidal Silica Slurry

• Copper CMP
• Barrier CMP
• Tungsten CMP
• Shallow Trench Isolation [STI] CMP
• ILD and PMD CMP
• Specialty Films
• PRAM [GST/IST]
• 3D Packaging CMP
• Wafer Polish Products