Differentiated Products. Superior Solutions.

At DA NanoMaterials, our mission is simple:
To be the leading and most admired supplier in the electronic polishing market with differentiated products and services by being the most responsive and trustworthy solutions provider.

Since 2000, we have strived to achieve this mission by providing:

• Differentiated products with superior performance and cost-effective solutions
• A global presence, allowing us to work with clients anywhere in the world
• Precise quality control to ensure product delivery
• Customized and tailored solutions to meet specific customer requirements

A History of Innovation

• January 2001 - DuPont iTechnologies and Air Products announce a joint venture, DA NanoMaterials.
• September 2001 – DA NanoMaterials launches MicroPlanar® STI2100™, a new product offering excellent planarization efficiency for shallow trench isolation [STI] CMP.
• January 2005 – DA NanoMaterials introduces CoppeReady® Cu3900, a CMP copper slurry product.
• September 2007 – CoppeReady® DP6545M-05 hits the market as a new, tunable barrier slurry for advanced technology nodes.
• September 2008 – DA NanoMaterials launches an innovative, copper CMP, CoppeReady® Cu3988, at SEMICON® in Taipei, Taiwan.

• Copper CMP
• Barrier CMP
• Tungsten CMP
• Shallow Trench Isolation [STI] CMP
• ILD and PMD CMP
• Specialty Films
• PRAM [GST/IST]
• 3D Packaging CMP
• Wafer Polish Products